Substrate for a microelectronic package and method of fabricating thereof

ABSTRACT

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.

CROSS-REFERENCED TO RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.11/400,665, filed on Apr. 7, 2006, the disclosure of which isincorporated by reference herein.

FIELD OF THE INVENTION

The present invention generally relates to microelectronic assembliesand, in particular, to substrates used in microelectronic assemblies andmethods of fabricating such substrates.

BACKGROUND OF THE INVENTION

Circuit panels or substrates are widely used in electronic assemblies.Typical circuit panels commonly include a dielectric element in the formof a sheet or plate of dielectric material having numerous conductivetraces extending on the sheet or plate. The traces may be provided inone layer or in multiple layers, separated by layers of dielectricmaterial. The circuit panel or substrate may also include conductiveelements such as via liners extending through the layers of dielectricmaterial to interconnect traces in different layers. Some circuit panelsare used as elements of microelectronic packages. Microelectronicpackages generally comprise one or more substrates with one or moremicroelectronic devices such as one or more semiconductor chips mountedon such substrates. The conductive elements of the substrate may includethe conductive traces and terminals for making electrical connectionwith a larger substrate or circuit panel, thus facilitating electricalconnections needed to achieve desired functionality of the devices. Thechip is electrically connected to the traces and hence to the terminals,so that the package can be mounted to a larger circuit panel by bondingthe terminals to contact pads on the larger circuit panel. For example,some substrates used in microelectronic packaging have terminals in theform of pins extending from the dielectric element.

Despite considerable efforts devoted in the art heretofore todevelopment of substrates and methods for fabricating such substrates,further improvement would be desirable.

SUMMARY OF THE INVENTION

One aspect of the present invention provides a method for fabricating asubstrate for a microelectronic package. The method desirably comprisesforming a molded dielectric layer which surfaces are coplanar with basesand tips of conductive pins of the substrate. Conductive traces may beformed on one or both sides of the dielectric layer.

Other aspects of the present invention provide substrates such as thosefabricated using the disclosed method. Still further aspects of theinvention provide microelectronic packages and assemblies which includeone or more such substrates.

The Summary is neither intended nor should it be construed as beingrepresentative of the full extent and scope of the present invention,which additional aspects will become more readily apparent from thedetailed description, particularly when taken together with the appendeddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow diagram illustrating a method in accordance with oneembodiment of the present invention;

FIGS. 2A-2I are schematic, plan (FIGS. 2A and 2I), bottom (FIGS. 2D and2F), and cross-sectional views (FIGS. 2B-2C, 2E, and 2G-2H) of portionsof a substrate during successive stages of the method of FIG. 1;

FIGS. 3A-3B are schematic, cross-sectional views of portions of asubstrate fabricated during successive stages of a method according to afurther embodiment of the invention;

FIGS. 4A-4D are schematic, cross-sectional views of portions of asubstrate fabricated during successive stages of a method according toanother embodiment of the invention;

FIGS. 5A-5C are schematic, cross-sectional views of portions of asubstrate fabricated during successive stages of a method according toyet another embodiment of the invention;

FIGS. 6A-6D are schematic, cross-sectional views of portions of asubstrate fabricated during successive stages of a method according tostill another embodiment of the invention;

FIG. 7A-7B are schematic, cross-sectional views of portions a substratefabricated during successive stages of a method according to one moreembodiment of the invention;

FIGS. 8A-8D are schematic, cross-sectional views of portions a substratefabricated during successive stages of a method according to yet furtherembodiment of the invention; and

FIGS. 9A-9D are schematic, cross-sectional views of exemplarymicroelectronic structures using the substrates fabricated in accordancewith the method of FIG. 1.

Herein, identical reference numerals are used, where possible, todesignate identical elements that are common to the figures. The imagesin the drawings are simplified for illustrative purposes and are notdepicted to scale.

The appended drawings illustrate exemplary embodiments of the inventionand, as such, should not be considered as limiting the scope of theinvention that may admit to other equally effective embodiments.

DETAILED DESCRIPTION

FIG. 1 depicts a flow diagram illustrating a method 100 for fabricatinga substrate having a molded dielectric layer in accordance with oneembodiment of the present invention. The method 100 includes processingsteps performed during fabrication of the substrate. In someembodiments, these processing steps are performed in the depicted order.In alternate embodiments, at least two of these steps may be performedcontemporaneously or in a different order. Sub-steps and auxiliaryprocedures (e.g., substrate transfers between processing reactors,substrate cleaning sub-steps, process control sub-steps, and the like)are well known in the art and, as such, herein are omitted.Cross-sectional views in the drawings are arbitrarily taken along acenterline 1-1 (shown in FIG. 2A only) of a conductive plate of asubstrate being fabricated using the method 100.

The method 100 starts at step 102 and proceeds to step 104. A methodaccording to one embodiment of the invention uses a conductive plate 200having a perimeter 202 (FIG. 2A). In this particular embodiment, theplate 200 comprises layers 204 and 206 of electrically conductiveprincipal metal (e.g., copper (Cu)) and a conductive barrier layer 208,such as a nickel (Ni) layer (FIG. 2B). A thickness of the plate 200 isgenerally selected in range from about 10 to 600 μm (e.g., 50 or 100μm), whereas the layers 204, 206, and 208 typically have thicknesses ofabout 5 to 300 μm, 5 to 300 μm, and 0.1 to 3 μm, respectively. In oneexemplary embodiment, the thicknesses of the layers 204, 206, and 208are 15, 50, and 1 μm, respectively.

At step 106, a plurality of conductive pins 210 and at least oneoptional spacer 212 are formed on the plate 200 (FIG. 2C). Each pin 210comprises a base 210A and a tip 210B, and the spacer 212 comprises abase 212A and a tip 212B. Widths of the bases 210A, 212A and tips 210B,212B are generally selected in a range from about 50 to 1000 μm, forexample, 200-300 μm.

The spacer 212 generally has a closed-loop wall-like form factor and isdisposed around an individual section of plate 200 or near the perimeter202 (as shown), thus surrounding at least some of the pins 210, asillustratively depicted in a bottom plan view (FIG. 2D) taken in thedirection of arrow 219 in FIG. 2C. In the particular embodiment, thespacer 212 comprises slots 218 (four slots 218 are arbitrarily shown)which may be used during a molding process of step 108, as discussedbelow in reference to FIG. 2E. In one embodiment, the pins 210 andspacer 212 are fabricated from the layer 206 by performing an etchprocess that uses the barrier layer 208 as an etch stop layer todetermine a duration of the etch process.

The pins 210 are formed at locations facilitating connectivity betweenelements of an electrical circuit of the substrate being fabricated.Such pins may have different form factors and be organized, for example,in one or more grid-like patterns having a pitch in a range from 100 to10000 μm (e.g., 400-650 μm).

In the next stage of the method, at step 108, a molded dielectric layer220 is formed on the plate 200 (FIGS. 2E-2G). In the molding process, aflowable composition is introduced between the pins 210 and cured toform the dielectric layer. The composition may be essentially anymaterial which will cure to a solid form and form a dielectric.

For example, compositions which cure by chemical reaction to form apolymeric dielectric, such as epoxies and polyimides may be used. Inother cases, the flowable composition may be a thermoplastic at anelevated temperature, which can be cured to a solid condition bycooling. Preferably, the layer 220, after molding, forms bindinginterfaces with features of the plate 200. The composition may furtherinclude one or more additives influencing properties of the layer 220.For example, such additives may include particulate materials such assilica or other inorganic dielectrics, or fibrous reinforcements such asshort glass fibers.

During the molding processes, the plate 200 is sandwiched between apress plate 214 and a counter element 216 (shown using phantom lines)which in this embodiment is part of a molding tool (FIG. 2E). Thecounter element 216 is abutted against the tips 210B of the pins 210 andthe flowable molding composition is injected or otherwise introducedinto the space between the plate 200 and counter element 216.

In the particular embodiment depicted in FIG. 2E, the moldingcomposition is injected through at least one opening, or gate, 217 inthe counter element 216 (as shown) and/or press plate 214. Slots 218 areused as an escape passage for trapped air, and may also vent excessmaterial of the molding composition. Upon completion of the moldingprocess, the press plate 214 and the counter element 216 are removed(FIG. 2G). Ordinarily, the tips 210B of the pins are free of moldingcomposition at the completion of the molding step. In some instances, athin film of molding composition may overlie the tips of some or all ofthe pins. If this occurs, the thin film can be removed by exposing thebottom surface 226 (FIG. 2G) of the molded dielectric layer to a briefplasma etching or ashing process which attacks the molded dielectric.

In a variant of the molding step, the composition may be injectedthrough the slots 218 in the spacer, and openings 217 in the counterelement may serve as a vent. Alternatively, one or more openings (notshown) can be formed through layers 204 and 208 of the plate, and theseopenings may serve either as injection openings for the composition oras vents. In yet another variant, the composition may be provided as amass disposed on the tips of the pins or on counter element 216 beforethe counter element is engaged with the tips of the pins, so that thecomposition is forced into the spaces between the pins as the pins arebrought into abutment with the counter element. In another variant, whenthe plate 200 includes multiple spacers 212 defining individual sectionsof the plate, the openings 217 may selectively be associated with suchsections.

In another embodiment, the plate 200 may be a portion of a larger frame242 incorporating a plurality of the plates 200 (FIG. 2F). As depicted,the frame 242 illustratively includes sprocket holes 244 and aperipheral wall 246, which upper surface is coplanar with the tips 210Band 212B in the component plates 200. In this embodiment, the pressplate and counter element of the molding tool are extended over theplate 242 and the spacer 246, respectively. Then, during the moldingprocess, the molding composition is introduced simultaneously into thespaces between the component plates 200 and counter element 216 throughindividual gates 217 flowably coupled to a runner system of the moldingtool. After the press plate and counter element are removed uponcompletion of the molding process, the component plates 200 may beseparated (e.g., cut out) from the frame 242. Alternatively, suchseparation may occur after step 110 discussed below in reference toFIGS. 2H-2I.

The molding step forms the dielectric element, or dielectric layer, witha bottom surface 226 coplanar with the tips 210B of the pins andcoplanar with the tip 212B of the spacer (FIG. 2G). The molding stepalso forms the dielectric element with a top surface 228 in engagementwith the layer 208 and hence coplanar with the bases 210A of the pinsand the base 212A of the spacer.

At step 110, conductive traces 230 are formed from the layers 204 and206 using, e.g., an etch process (FIGS. 2H-2I). Together with the pins210, the traces 230 form an electrical circuit of a substrate 240fabricated using the method 100. Each trace 230 may be connected to atleast one pin 210 and/or to at least one other trace. However, sometraces may “float”, i.e., be electrically disconnected from pins andother traces. Likewise, one or more of the pins may remain unconnectedto traces, although typically most or all of the pins are connected totraces.

At least one trace 230 may be a peripheral trace 230A having aclosed-loop pattern and surrounding at least some of pins or othertraces as illustratively shown in FIG. 2I, where such traces aredepicted using solid lines connected to bases of the respective pins orother traces. In the depicted embodiment, the peripheral trace 230A isdisposed on the spacer 212. The peripheral trace may further comprisecontact areas 232 having greater widths than other portions of thetrace. In operation, the peripheral traces, as well as the spacers 212,may reduce electromagnetic interference (EMI) between electricalcircuits present on the same or adjacent substrates.

The traces 230 may have different widths, including the widths which aresmaller than the widths of the bases 210A and tips 210B of the pins 210(as shown in FIGS. 2H-2I), thus facilitating fabrication of thesubstrate 240 having high routing density. Generally, the widths of thetraces 230 are selected in a range from about 5 to 100 μm (e.g., 20-40μm), however, portions of traces (e.g., contact areas 234) or sometraces may have widths greater than 100 μm.

A substrate 340A according to a further embodiment has a recess 302formed in a central region, recess 302 being open to the bottom surface226 of the dielectric layer. Such a substrate can be formed by a processsubstantially as discussed above with reference to FIGS. 2A-2I, exceptthat the pin-forming step is conducted so that no pins are formed in thecentral region, and the molding step is modified by using a counterelement (not shown) having a projection extending upwardly in thecentral region.

In a substrate 340B of the embodiment of FIG. 3B, the recess 306 extendsall the way to the top surface 228 and thus forms an opening extendingthrough the dielectric layer. Such a recess may be formed by aprojection on the counter element which engages the plate during themolding process. In the embodiment of FIG. 3B, the traces do not extendacross the recess. However, some or all of the traces may extend acrossthe recess.

Alternatively, the dielectric layer may be fabricated using a counterelement without such a projection, so that the entire bottom surface asmolded is flat, and then machined or etched to form the recess 302 oropening 306. In further variants, two or more recesses may be providedin the dielectric layer. Also, the recess need not be provided in acentral region of the substrate.

A substrate 440 according to a further embodiment of the invention isfabricated using a conductive plate 400 having a single layer 406 of theprincipal metal (e.g., Cu and the like) (FIG. 4A). Conductive pins 410and an optional spacer 412 are formed on the plate 400 using an etchprocess or a plating process (FIG. 4B). The dielectric layer 220 (FIG.4C) is fabricated using the process described above in reference to FIG.2E. Then, conductive traces 430, including optional peripheral traces430A, may be formed from the plate 400 using an etch process, therebycompleting a process of fabricating the substrate 440 (FIG. 4D).

A substrate according to yet another embodiment of the invention isfabricated using two conductive plates 200 and 500 (FIG. 5A). In oneembodiment, the plate 500 comprises a single layer 504 of the principalmetal. In an alternate embodiment (not shown), a layer of conductivebonding material may be formed on an upper surface 506 of the layer 504.In one particular embodiment (FIG. 5B), the plate 500 is connected tothe tips 210B of the pins 210 using a conventional metal-couplingprocess, such as thermosonic or ultrasonic bonding, eutectic bonding,solder bonding or the like. Then, during the molding process, the plate500 serves as a counter element. In the molding operation, the polymeris injected between the plates 200 and 500. Alternatively, thedielectric layer is molded as described above in reference to FIG. 2E,and then the plate 500 is disposed on a bottom surface of the moldeddielectric layer and, using metal-coupling process, is connected to thetips of the pins.

Then, conductive traces 530 are fabricated from the plate 500 (FIG. 5C).The traces 530 may be formed before, after, or contemporaneously withthe traces 230 using the same technique (i.e., etch process). The traces530 may include optional peripheral traces (one peripheral trace 530A isillustratively shown). Together, the pins 210 and traces 230, 530 forman electrical circuit of the substrate 540.

A process according to a further embodiment uses two conductive plates.Illustratively, such plates are multi-layered plates 200A and 200B (FIG.6A), each of which includes principal metal layers 204 and 206 and etchstop layer 208 similar to the layers discussed above with reference tothe plate 200 of FIG. 2B. In alternate embodiments, at least one ofthese plates may be formed from a single layer of the principal metal,such as Cu.

Pins 210 are fabricated in the plate 200A as discussed above inreference to FIG. 2C, and, similarly, pins 610 having bases 622 and tips624 are fabricated in the plate 200B (FIG. 6B). The locations of thepins 610 are selected so that, when the plates 200A and 200B areassembled together, the pins 210 and 610 can be mutually interspersedwith each other in at least one region of a substrate 640. For example,pins 210 can be provided as a first regular grid pattern having aparticular pitch, whereas pins 610 can be provided as a second regulargrid pattern having the same pitch.

Since the pins are tapered (i.e., tips of the pins are smaller thantheir bases), in such a substrate the interspersed pins may be disposedcloser to one another than the pins formed on the same plate, thusincreasing density of the conductive pins in the substrate beingfabricated. The tips 210B of the pins on the first plate 200A areabutted against the second plate 200B, whereas the tips 610B of the pinson the second plate are abutted against the first plate 200A. Then,using a conventional metal-coupling process, the tips 210B of the pins210 are connected to the plate 200B and the tips 610B of the pins 610are connected to the plate 200A, respectively.

The dielectric layer 220 is molded in the space between the plates (FIG.6C) using a process discussed above in reference to FIG. 2E where one ofthe plates may be used as a counter element. Using an etch process, thelayers 204 and 208 of the plates 200A, 200B are patterned to form thetraces 230 and 630 (including optional peripheral traces 230A and 630A)of the substrate 640.

A process according to another embodiment uses the press plate andcounter element forming, around a perimeter of the substrate beingfabricated, an enclosure for the molding composition. The substrates maybe fabricated with a peripheral spacer (substrate 740A in FIG. 7A andsubstrates in FIGS. 9C-9D), as well as without the spacer (substrate740B in FIG. 7B).

A process according to yet further embodiment uses a single plate 804(FIG. 8A). The plate 804 is formed from the principal metal (e.g.,copper plate) to a thickness from about 10 to 300 μm. Then, a barrierlayer 808 (e.g., Ni barrier layer) is deposited on a bottom surface ofthe plate 804 (FIG. 8B). The barrier layer 808 is patterned to form, atpre-determined locations, pads 805 for conductive pins and optionalspacers (FIG. 8C). Conductive pins 810 and spacers 812 may be formed onthe pads 805 using, for example, a plating process (FIG. 8D). In thedepicted embodiment, a resulting structure includes a peripheral spacerhaving slots 818. Such a structure may further undergo molding andetching processes discussed above in reference to FIGS. 2D-2I.Structures with plates and pins can be formed in other ways as well. Forexample, such a structure can be formed by coining a single metal layeror a multi-layer metallic laminate.

Substrates fabricated according to yet further embodiments the method ofFIG. 1 may comprise combinations of features discussed above inreference to the substrates 240, 340A-340B, 440, 540, 640, and740A-740B. For example, the substrates 440, 540, 640, and 740A-740B mayinclude recesses and/or openings, like those included in substrates340A-340B.

FIGS. 9A-9D depict a series of schematic, cross-sectional views ofexemplary structures using the substrates fabricated in accordance withthe method of FIG. 1.

Microelectronic elements, or devices, may be mounted on the substratesusing techniques such as a ball-bonding and/or wire-bonding technique.In FIGS. 9A-9D, the devices adapted for mounting using the ball-bondingand wire-bonding techniques are collectively denoted using referencenumerals 906 and 908, respectively. Similarly, such techniques may beused for connecting the substrates stacked on one another or juxtaposedsubstrates.

More specifically, the FIGS. 9A, 9B, and 9C depict exemplarymicroelectronic structures or units 901, 902, and 903 each comprisingone substrate 240, 540, and 640, respectively. In the embodimentdepicted in FIG. 9A, the substrate 240 is disposed on and connected to acircuit panel 912 and includes an electrically conductive EMI shield910. The tip ends of the pins of substrate 212 are solder bonded tocontact pads of circuit panel 912. The microelectronic devices 906, 908and the EMI shield 910 are mounted on an upper surface 241 of thesubstrate 240. The EMI shield 910 is ball-bonded to the peripheral trace230A of the substrate and, as such, electrically connected to the spacer212. Herein, the spacer 212 is further connected to ground contact pads914 of the circuit panel 912. For example, the unit including substrate240, devices 906 and 908 and shield 910 may be mounted to panel 912using solder-bonding techniques commonly used for surface-mountingmicroelectronic elements on circuit boards. In embodiments shown inFIGS. 9B and 9C, the devices 906 and 908 are mounted on both sides ofthe substrates 540 and 640, respectively.

The substrates discussed above may be interconnected to formmulti-substrate structures. FIG. 9D depicts an exemplary assembly, orpackage, 904 comprising two stacked units 640A and 640B, each of whichincludes a substrate as discussed above. One of the stacked units(denoted using a reference numeral 640B) has a recess formed in themolded dielectric layer of the substrate. Thus substrate of the otherunit 640A constitutes a panel having a top surface, contact pads exposedat the top surface of said panel, and an additional circuit element 906mounted to said panel and extending upwardly therefrom. The dielectriclayer of unit 640B overlies the top surface of the panel in unit 640A.The additional circuit element 906 is received in the recess. The tipends of the pins in unit 640A are bonded to the contact pads of saidpanel. Illustratively, the peripheral lines and a portion of the tracesof the stacked substrates of the units 640A and 640B are also connectedusing such a technique to form the assembly 904. In a variant, theassembly 904 may comprise more than two substrates, or the substrates ofdifferent types.

Although the invention herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent invention. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present invention as defined by the appended claims.

1. A method of fabricating a microelectronic substrate comprising thesteps of: (a) providing a first electrically conductive plate with aplurality of first contact pins projecting from such plate; (b) moldinga dielectric layer around the first pins; and (c) forming from the firstplate a plurality of first traces so that at least some of the tracesare coupled to at least some of the first pins.
 2. The method of claim 1wherein said molding step is performed so as to form said dielectriclayer with a surface coplanar with tip ends of the pins remote from thefirst plate.
 3. The method of claim 2 wherein said molding step includesabutting a counter element against the tip ends of the pins andintroducing a flowable molding composition around said pins, betweensaid plate and said counter element.
 4. The method of claim 3 whereinsaid counter element is a second electrically conductive plate, themethod further comprising bonding the tip ends of the pins to the secondelectrically conductive plate.
 5. The method of claim 4 furthercomprising the step of forming conductive traces from the second plateso that at least some of the second traces are coupled to at least someof the pins.
 6. The method of claim 4 wherein said second plate haselectrically conductive second pins projecting therefrom, said abuttingstep including abutting tip ends of said second pins remote from saidsecond plate against the first plate and bonding the tip ends of thesecond pins to the first plate.
 7. The method of claim 6 wherein saidabutting step includes positioning the plates so that at least some ofthe second pins are interspersed with at least some of the first pins toform an array including first and second pins in alternatingarrangement.
 8. The method of claim 7 wherein said first pins aretapered and have bases at said first plate of greater diameter than thetip ends of the first pins, and wherein said second pins are tapered andhave bases of greater diameter than the tip ends of the second pins,said positioning step placing at least some of the tip ends of the firstpins between bases of the second pins and at least some of the tip endsof the second pins between bases of the first pins.
 9. The method ofclaim 6 wherein said step of forming said first traces is performed sothat at least some of said first traces are coupled to tip ends of saidsecond pins.
 10. The method of claim 6 further comprising forming fromsaid second plate a plurality of second traces, at least some of saidtraces being coupled to at least some of said pins.
 11. The method ofclaim 4 wherein one of said plates has a wall projecting therefrom, saidabutting step including abutting the wall against the other one of saidplates so that said wall at least partially surrounds at least some ofsaid pins, the step of introducing the molding composition includingintroducing the molding composition inside the wall.
 12. The method ofclaim 11 wherein said wall has at least one opening therein, furthercomprising allowing air to escape through said at least one openingduring introduction of the molding composition.
 13. The method of claim11 wherein said wall has at least one opening therein, said step ofintroducing the molding composition including introducing the moldingcomposition through said at least one opening.
 14. The method of claim 4wherein said step of introducing the molding composition includesintroducing the molding composition through at least one hole in atleast one of said plates.
 15. The method of claim 3 wherein said counterelement is a tool, the method further comprising removing said counterelement after introducing the molding composition.
 16. The method ofclaim 15 wherein said step of introducing a molding composition includesintroducing the molding composition through a hole in the counterelement.
 17. The method of claim 15 wherein said first plate has a wallprojecting therefrom at least partially surrounding at least some ofsaid pins, said abutting step including abutting said wall against saidtool, said introducing step including introducing the moldingcomposition inside said wall.
 18. The method of claim 17 wherein saidwall has at least one opening therein, further comprising allowing airto escape through said at least one opening during introduction of themolding composition.
 19. The method of claim 17 wherein said wall has atleast one opening therein, said step of introducing the moldingcomposition including introducing the molding composition through saidat least one opening.
 20. The method of claim 1 further comprising thestep of mounting a microelectronic device to the substrate so thatcontacts of the microelectronic device are electrically connected to atleast some of the pins.
 21. The method of claim 1 wherein the at leastone plate is predominantly formed from Cu.
 22. The method of claim 1wherein said step (a) includes forming the pins on the plate.
 23. Themethod of claim 22 wherein said forming step includes etching aprecursor element comprising a conductive barrier layer sandwichedbetween conductive structural layers.
 24. The method of claim 23 whereinsaid forming step includes forming the pins from material of one of saidstructural layers performing an etch process that uses the barrier layeras an etch stop layer.
 25. The method of claim 1 wherein said moldingstep includes molding the dielectric layer from epoxy.
 26. The method ofclaim 1 wherein said molding step comprises: molding the dielectriclayer in one region of the substrate to a substantially smallerthickness than in adjacent regions of the substrate.
 27. The method ofclaim 26 wherein said molding step is performed so that the region ofsubstantially smaller thickness lies in a region of said substratedevoid of said pins.
 28. The method of claim 1 wherein the step (c)comprises: forming the traces using an etch process.
 29. The method ofclaim 1 wherein the step (c) further comprises: forming traces havingwidths equal to or smaller than widths of the ends of the pins coupledto the traces.
 30. The method of claim 1 further comprising: selectivelycoupling the substrate using a ball bonding technique to other substratedisposed above or beneath said substrate.
 31. The method of claim 30further comprising: selectively interconnecting the pins and/or tracesof said substrates.
 32. The method of claim 1 further comprising:selectively coupling the substrate using a wire bonding technique to atleast one other substrate juxtaposed with said substrate.
 33. The methodof claim 32 further comprising: selectively interconnecting the tracesof said substrates.
 34. The method of claim 1 wherein the firstelectrically conductive plate is a region of a conductive frameincorporating a plurality of such plates.
 35. The method of claim 34wherein the frame comprises a peripheral wall surrounding said pluralityof plates and having an upper surface coplanar with tip ends of the pinsof said plates.
 36. The method of claim 34 wherein said molding stepincludes abutting a counter element against the tip ends of the pins ofsaid plurality of plates and introducing a flowable molding compositionaround said pins and between each of said plates and said counterelement.
 37. The method of claim 34 further comprising: separating saidplates after the molding step.
 38. The method of claim 34 furthercomprising: separating said plates after the forming step.